PCB Layout CAD : DRC/MRC Settings
Other DRC Settings
The Other DRC Settings allows you to configure the following settings:
・The minimum number of thermal objects.
・Whether to create lands for through holes / vias that do not have a connection to a route / plane in inner layers.
・Whether to allow via stacking.
・The allowable distance between stacked vias.
For more details about opening the DRC/MRC Settings screen, refer to About DRC/MRC Settings.
Setting Items
Minimum No. of thermal connection
| Item | Description |
|
Minimum No.of Connections |
Specifies the minimum number of thermal connections that connect to dynamic planes. |
Inner Layer Connection of Pad/Via
| Item | Description |
|
Create the Inner Layer Land with no connection |
Enables to create lands for through holes / vias that do not have a connection to a route / plane in inner layers. For more details, see Convenient Functions for Inner Layers. |
Via
| Item | Description |
|
Allow Stack Via |
Enables to connect multiple vias placed on the same coordinates. |
|
Allowable Misalignment |
Specifies the allowable distance to judge overlapping vias as Stack Via. If the center of each via is within the allowable value, a Same Net Clearance error will not be detected by DRC. |