Quadcept : Various References

Reference: Pad Dimension

The following will explain the reference Pad Dimensions used by our company's Design Department.
These are references used by our company, so they may differ depending on the component type and board manufacturing method.

For taking pad (land) intervals, different dimensions from the references below may be used for creation.
* Principally, Solder Resist is created using the pad (land) dimensions +0.2 (+0.1 for one side), but it may be made smaller when the interval cannot be taken.

Reference Pad Size (SMD)

Pitch Lead Width Electric
(Top)
Land Width
Electric
(Top)
Land Height
Paste
(Top)
Metal Mask
Solder
(Top)
Solder Resist
0.5 0.2 0.25 Lead Length +1.0 One Side +/-0

* Settings are easier if ImitationPad is specified.
 
One Side +0.1
0.5 0.27 0.3 One Side +0.1
0.5 0.3 0.35 One Side +0.15
0.65 0.3 0.3 One Side +0.2

* Settings are easier if ImitationPad is specified.
 
0.8 0.35 0.45
1.0 0.4 0.5
1.27 0.45 0.6


Reference Pad Size (Through)

Lead Diameter

Hole Diameter

Electric
(Top, Inner, Bottom)
Land Width
Solder
(Top, Inner, Bottom)
Solder Resist
0.4 0.8 1.4


One Side +0.1

* Settings are easier if ImitationPad is specified.
 

0.5 0.8 1.4
0.6 0.8 1.4
0.7 0.9 1.5
0.8 1.0 2.0
0.9 1.1 2.2
1.0 1.2 2.4
1.1 1.4 2.8
1.2 1.6 3.2
1.3 1.7 3.4
1.4 1.8 3.6
1.5 2.0 4.0
1.6 2.1 4.2
1.7 2.2 4.4
1.8 2.3 4.6
1.9 2.4 5.0
2.0 2.5 5.0

Unit (mm)